Infineon Technologies selects 6 MIET students for R&D internship

Excelsior Correspondent
JAMMU, July 8: Germany-based Infineon Technologies (formerly Siemens AG) selected six final-year students from MIET for their highly paid R&D internship programme during campus drive at MIET Jammu.
The selected students from MIET will undergo an eleven-month internship programme at various research divisions at Infineon Technologies, Bengaluru at a handsome stipend of Rs 25,000 per month.
Infineon Technologies follows a unique recruitment model selecting promising engineering graduates from across the country for the internship programme and then absorbing the interns at an annual package of Rs 11 lakh which will potentially be the highest package received by students from J&K till date.
The selected students included Vikas Chib, Karishma Jamwal, Phalguni Kargotra and Rajesh Bhau from Electronics and Communication and Raghav Mahajan, Saurabh Sharma from Computer Science and Engineering branches.
Four more students from MIET stand shortlisted and the final result on their selection shall be notified by Infineon within one week’s time. These students were selected from over 120 students belonging to 10 colleges and universities across North India after a rigorous selection process conducted by a five-member high-level team from Infineon Technologies.
Eishwar Hegde, Manager HR, Infineon Technologies appreciated MIET for the support extended in organizing the placement drive and the talent of MIET students. Based on the first engagement, Infineon Technologies has confirmed the conduct of annual campus drives at MIET, besides supporting MIET in conducting high quality projects in core engineering domains.
Director MIET, Prof Ankur Gupta and Director, Academics, MIET, Prof SK Sharma assured Infineon Technologies of extending all possible support in future drives as well. Brig PN Sharma, Placement Officer, MIET along with Sahil Sawhney, Manager Strategic Initiatives, were instrumental in the successful organization of the campus drive.